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Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
受賞
2016.10.11

バイオロボティクス専攻の劉 聡さんが、Pacific Rim Meeting on Electrochemical and Solid-State Science 2016 (PRiME 2016)において、Outstanding Student Paperを受賞しました。
受賞日: 2016年10月5日
賞名: Outstanding Student Paper
受賞論文題目: Wafer-level Vacuum Packaging by Thermocompression Bonding using Silver after Fly-cut Planarization
授与団体: Pacific Rim Meeting on Electrochemical and Solid-State Science 2016 (PRiME 2016)
受賞者: 劉 聡(Cong Liu)、博士課程2年生、田中(秀)研究室
受賞
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猪股直生 准教授、小林桃子 さん、岡谷泰佑 助教、金森義明 教授(ロボティクス専攻)が電気学会論文誌E「センサ・マイクロマシン英文特集号」優秀論文賞を受賞(26/1/26)
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