プレスリリース
2026.10.21
半導体先端パッケージング・ヘテロ集積化技術に関する研究開発コンソーシアム”T-CHIPS”が始動 ―後工程技術による半導体の高度化を目指して―(田中 秀治 教授)
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Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
Tohoku University “Mechanical Engineering” is a place to challenge research for human happiness and the future in the world's best environment. We create tomorrow's affluence with free ideas.
トピックス
2021.08.05
航空宇宙工学専攻の浅井圭介教授が共著で執筆した感圧・感温塗料の教科書『Pressure and Temperature Sensitive Paints (Second Edition)』がSpringerから出版されました。
書籍タイトル: Pressure and Temperature Sensitive Paints (Second Edition)
著者 : Tianshu Liu (Western Michigan University, USA), John P. Sullivan (Purdue University, USA),Keisuke Asai (Tohoku University,Japan), Christian Klein (DLR, Germany), Yasuhiro Egami (Aichi Institute of Technology, Japan)
発売日 :2021年7月31日
発行元 :Springer
紹介ページ : Amazon | Pressure and Temperature Sensitive Paints (Experimental Fluid Mechanics) (English Edition) [Kindle edition] by Liu, Tianshu, Sullivan, John P., Asai, Keisuke, Klein, Christian, Egami, Yasuhiro | Mechanical | Kindleストア
総ページ数 :755ページ
※共著者の江上 泰広教授(愛知工業大学)も機械系(流体科学研究所)のご出身です。

プレスリリース
2026.10.21
半導体先端パッケージング・ヘテロ集積化技術に関する研究開発コンソーシアム”T-CHIPS”が始動 ―後工程技術による半導体の高度化を目指して―(田中 秀治 教授)
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受賞
2026.10.21
栢分 崚汰郎さん(昆陽研究室・D1)が SICE International Young Authors Award for IROS2026を受賞(26/9/28)
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受賞
2026.10.20
山崎向陽さん、猪股祥大さん (高研究室・M2)が 2026年度精密工学会秋季大会学術講演会 ベストプレゼンテーション賞を受賞(26/9/17)
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受賞
2026.10.16
佐藤 遼 助教(ファインメカニクス専攻)が精密工学会 吉澤論文賞を受賞(26/9/15)
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受賞
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椿 亮悟さん(雨澤研究室・M2)が多元物質科学研究所 所長賞を受賞(26/9/30)
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